VC50 Vari/Cut Sectioning Saw

LECO VC50 Wafering SawMetallography saw bladeHand adjusting speedHand adjusting dial

Precision Cutting Made Simple

The VC50 Vari/Cut Saw is engineered for low-speed, low-deformation sectioning of metals, ceramics, minerals, and electronic components with unmatched accuracy. The compact design and automatic shut-off for unattended operation make it an ideal choice for any laboratory. With versatile options and accessories, the VC50 delivers reliability, convenience, and precision in one small, powerful package.


Why Choose the LECO VC50

Hand adjusting speed

Minimize Subsurface Damage

The VC50 is designed to preserve material integrity during sectioning by combining low cutting speeds with controlled cutting forces. This precision approach minimizes subsurface deformation such as microcracks, smearing, and structural alterations, helping ensure the specimen remains representative of its original condition for accurate analysis.

Opening a drawer

Protect Heat-Sensitive Materials

Precision cutting conditions and continuous coolant flow help prevent excessive heat buildup during sectioning. By minimizing thermal effects, the VC50 reduces the risk of microstructural changes in heat-sensitive materials, allowing laboratories to prepare samples with greater confidence and maintain the integrity of critical features.

Metal piece in vice for cutting

Ideal for Delicate and Challenging Samples

The VC50 is well suited for brittle, soft, and otherwise difficult-to-section materials, including ceramics, coatings, electronic components, composites, and other sensitive specimens. A comprehensive set of standard sample holders provides secure fixturing for a wide range of sizes and geometries, making it easier to section complex samples accurately and consistently.

Metallography saw blade

Precision Sectioning with Minimal Material Loss

Designed for high-accuracy cutting applications, the VC50 produces thin, precise cuts while minimizing kerf loss. This capability is particularly valuable when working with small specimens, expensive materials, or applications requiring analysis of a specific region, helping maximize sample utilization and preserve critical features.

LECO VC50 Wafering Saw

Improve Surface Finish

By producing clean, low-deformation cuts, the VC50 reduces the amount of material removal required during subsequent grinding and polishing steps. Improved cut quality helps streamline the overall preparation process, saving time while contributing to more consistent and reliable results.



コア分析


How the VC50 Works

The VC50 is engineered to make clean, accurate cuts with minimal material damage. After securing a sample in the integrated vice, operators use the micrometer (available in metric or U.S. standard) to set cutting location and depth.  

Easy-to-use controls allow adjustments to numerous settings, such as cutting speed, cutting force (through a sliding counterweight), and lubrication amounts.  

A diamond-edged cutting wheel is included for use in sectioning extremely hard materials, such as carbides, ceramics, and hardened steels. Interchangeable wheels and coolants allow for easy adaptation for softer materials and specific laboratory requirements.  

During the cutting process, the sliding weight and slow‑speed control enable gradual material engagement to reduce heat, stress, and surface damage. Once a groove is established, cutting force and speed can be carefully increased to balance efficiency with sample integrity. This controlled, stepwise approach prioritizes sample quality for successful further analysis.


楽器の詳細

特徴

Low-speed precision sectioning design
Minimizes deformation, microcracking, and subsurface damage, preserving the original material structure for accurate analysis.
Precision diamond cutting wheel included
Produces clean, precise cuts with minimal material loss, even on extremely hard materials.
Variable speed control (0-500 rpm)
Allows cutting parameters to be optimized for different materials and applications, helping protect delicate specimens.
Constant-speed electronics
Maintains consistent cutting performance under varying loads for improved repeatability and cut quality.
Precision micrometer positioning system
Ensures highly accurate sample placement and section thickness control for demanding applications.
Low-kerf cutting capability
Reduces material loss, making it ideal for small, expensive, or limited-quantity samples.
Integrated sample vise
Securely holds samples up to 1.5 in (38 mm) diameter for precise and repeatable sectioning.
Automatic shutoff for unattended operation
Increases laboratory productivity by freeing operators to perform other tasks during sectioning.

オプション

Irregular Shape Specimen Holder
Thin Section Holder
Flanges for 4″ (102 mm) wheel


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